Ciena (NYSE: CIEN) will showcase its latest innovations for AI infrastructure, data center networking, optical connectivity, and out-of-band management at the Open Compute Project (OCP) Global Summit 2026, taking place October 13-15 in San Jose, Calif.

At the Ciena booth (A16), attendees will see how Ciena is helping cloud providers, hyperscalers, and AI infrastructure operators accelerate AI interconnect and deliver high-performance, scalable, and power-efficient networks. Demonstrations will highlight Ciena’s hyperscaler expertise and advanced networking portfolio, including high-density Nitro electrical and Vesta optical interconnects for scale-up and scale-out architectures, WaveLogic coherent optics and RLS Hyper-Rail for scale-across connectivity, and Data Center Out-of-Band Management (DCOM) for secure, dedicated network access.

Demonstrations:

  • AI-Ready DCOM: simple, secure, and scalable out-of-band (OOB) management – Featuring DCOM 3822 and 3823 chassis and the new DCOM ONU portfolio, including the 3824 and 3826, the demonstration will show how fiber-based PON architectures simplify operations, reduce cabling complexity and rack footprint, and provide scalable connectivity for AI-driven data center environments.
  • Nitro 2004: Extending DAC Reach for High-Speed Networks – Showcasing Ciena's Nitro 2004 linear redriver that extends Direct Attach Copper (DAC) cable reach to up to four meters while maintaining low power consumption, zero software configuration, and simplified integration.

  • Vesta 200 6.4T CPX optical engine for next-generation AI factories – Standards-based, pluggable optical engine that enables solutions scaling to 200T while reducing power consumption by up to 70% compared to traditional architectures. The demonstration will show how the Open CPX MSA-compliant Vesta optical engine delivers strong bit error rate performance and dense optical connectivity required for upcoming AI scale-up and scale-out networks.
  • Scale-across: high-density connectivity for distributed training – Featuring Ciena’scoherent optical technology and RLS innovations, including RLS Hyper-Rail, to address the growing connectivity demands of distributed AI infrastructure. Attendees will see how Ciena’s RLS Hyper-Rail delivers a 32x density improvement, enabling greater capacity in less space while simplifying deployment and improving power efficiency.
  • Scaling system power with liquid cooling – Attendees will learn more about Ciena's liquid cooling capabilities that support high-density compute environments through direct-to-plug liquid cooling innovations, including liquid-cooled 12.8T XPO modules supporting both linear drive and coherent optical designs.

Speaking Sessions: 

Tuesday, October 13

  • 1 p.m. (Concourse Level, Room 230A) – Peter Winzer, VP, Systems Architecture, will participate in the “Revolutionizing AI Scale Up with Pluggable NPO: Why Does It Matter?” workshop, focused on how near-package optics can overcome the limitations of traditional electrical interconnects and enable the next generation of large-scale AI systems through higher bandwidth, improved efficiency, and deeper optical integration.

Wednesday, October 14

  • 12:50 p.m. (Concourse Level, Room 210AE) – Frank Chang, Senior Director, Product Line Management, will present in the "The Future of Coherent Optics in the AI Era" session, exploring the evolution of coherent optical technologies, including 1.6T and 3.2T innovations, liquid-cooling readiness, and emerging architectures shaping future AI networks.
  • 3:20 p.m. (Expo Hall Theater) – Matt Bolig, Senior Advisor, Product and Technology Marketing, will present in the “Extending Copper for Efficient Next-Generation Scale-Up Networks" session, examining how active copper technologies can improve reach while maintaining low power consumption, low latency, and operational simplicity.
  • 3:40 p.m. (Concourse Level, Room 220B) – Spencer Giacalone, Senior Director, Cloud AI Architecture and Helen Xenos, Senior Director, Product Marketing, will speak in the “From Single Data Centers to Multi-Region AI Clusters: The Rise of Scale Across" session, focused on ways distributed AI training is driving new networking architectures and connectivity requirements.

For more information about Ciena's participation at OCP Global Summit 2026 or to schedule a meeting, visit this link or contact pr@ciena.com.

About Ciena
Ciena is the global leader in high-speed connectivity. We build the world’s most advanced networks to support exponential growth in bandwidth demand. By harnessing the power of our networking systems, interconnects, automation software, and services, Ciena revolutionizes data transmission and network management. With unparalleled expertise and innovation, we empower our customers, partners, and communities to thrive in the AI era. For updates on Ciena, follow us on LinkedIn or visit the Ciena website.

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