Demonstrations and speaking sessions showcase the technologies essential to scalable AI connectivity

Ciena (NYSE: CIEN) will showcase some of the company’s latest high-performance AI connectivity solutions at Futurecom 2026, taking place October 6–8 in São Paulo, Brazil. At booth #I30, attendees can learn more about how Ciena’s industry-leading WaveLogic 6 Extreme (WL6e)1.6 Tb/s solution, data center interconnect (DCI) optical technology, and coherent routing solutions can help service providers and data center operators create scalable networks to support growing AI and data demands.

Demonstrations:

Speaking Sessions:

  • Tuesday, October 6 at 4:30 p.m. (Arena Future Talks) – Ricardo Franco, Global Submarine Sales Senior Consultant, will participate in a session titled,“The network behind AI: Are we ready for the next data explosion?”
  • Wednesday, October 7 at 1:30 p.m. (Arena ISP Next Level) – Décio Coraça, Director, Sales Engineering, will participate in a session titled,“The next phase of AI connectivity: How CSPs can capitalize on emerging demand”
  • Wednesday, October 7 at 3:20 p.m. (Palco 3) – Fernando Capella, Regional Director, CALA South, will participate in an executive panel moderated by Telegeography,“Has the seabed become critical to the new digital infrastructure?”

For more information about Ciena’s participation at Futurecom 2026 or to schedule a meeting, visit this link or contact pr@ciena.com.

About Ciena
Ciena is the global leader in high-speed connectivity. We build the world’s most advanced networks to support exponential growth in bandwidth demand. By harnessing the power of our networking systems, interconnects, automation software, and services, Ciena revolutionizes data transmission and network management. With unparalleled expertise and innovation, we empower our customers, partners, and communities to thrive in the AI era. For updates on Ciena, follow us on LinkedIn or visit the Ciena website.

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