ECOC Exhibition 2025
Meet AI and data center demand with high-performance connectivity
As the global leader in high-speed connectivity, Ciena is redefining networks for the AI and cloud era. Learn how you can achieve unprecedented levels of speed, scale, and flexibility in your data center networks with the most advanced interconnect technologies, fully instrumented programmable photonics, and AI-driven multi-layer operations.
Look for us on the agenda
Powering AI: Exploring modulation strategies for 448G electrical interconnectsThe topic of 448 Gb/s per lane speeds for data center networking has become one of the hottest discussions in the industry driven by the relentless push of AI. Modulation format is one of the foundational decisions that needs to be made in order to advance this new technology. Current experimental data suggests that PAM4 is likely a reasonable choice for 448G optical interfaces. However, electrical interfaces present additional challenges. This presentation walks through and analyzes extensive experimental data measured using Ciena high-bandwidth 3 nm silicon, exploring the benefits and challenges for electrical interconnect using a variety of modulation formats. | Naim Ben-Hamida, Sr. Director of Analog Engineering |
Beyond 1600ZR: Liquid cooling, advanced optics, and the evolution of the pluggableAs the number of XPUs required for LLM training exponentially increases from tens to hundreds of thousands and power density per rack increases while total data center power remains constant, new innovations in higher-speed, low-power, and high-performance optical interconnects are needed. This session provides insights into the next generation of coherent pluggable transceivers that will power networks of the future, including 1600ZR, 1600ZR+, and beyond. Examples of technology readiness will be presented, from 3 nm to 2 nm and 18A CMOS technology nodes to 140 GHz-capable electro-optics. The foundational shift from air-cooled to liquid-cooled pluggables with the 3.2T generation will also be presented, including design details recently presented at the OSFP MSA. | Frank Chang, Sr. Director of Product Line Management, WaveLogic Technologies |
AT THE BOOTH
Demonstrations
Visit our booth to hear more about our industry-leading solutions.
WaveLogic™ 6 Nano
800G ZR+The fastest low-power interconnect available today: Ciena's WaveLogic 6 Nano (WL6n) 800G ZR+ with interoperable PCS
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The fastest low-power interconnect available today: Ciena's WaveLogic 6 Nano (WL6n) 800G ZR+ with interoperable PCS
WL6n 1.6T Coherent-Lite PluggableThe industry’s first coherent 1.6T in a pluggable; a key enabler for scaling geographically distributed AI clusters
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The industry’s first coherent 1.6T in a pluggable; a key enabler for scaling geographically distributed AI clusters
Next-generation intra-data center interconnectThe latest in a series of industry-first demos Ciena has shown at the 448G speed node, dating back to 2024
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The latest in a series of industry-first demos Ciena has shown at the 448G speed node, dating back to 2024
6500 Reconfigurable Line SystemSimple, automated deployments spanning core to edge
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Simple, automated deployments spanning core to edge
Navigator Network Control Suite™IP/Optical coordination, pluggables and routers, and GenAI workflows for dynamic network assurance
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IP/Optical coordination, pluggables and routers, and GenAI workflows for dynamic network assurance
- September 29–October 1, 2025
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Bella Center
Center Boulevard 5, 2300
Copenhagen, Denmark - Booth C2129